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TDK Product Features
In order to reduce the size and increase the capacity of multilayer ceramic chip capacitors, we pursue ultra-fine particle size through advanced material technology. We use our unique process technology to establish a highly laminated technology with no misalignment between the dielectric layer and the electrode layer, and a multi-layer technology of up to 1,000 layers. The interlayer thickness of one layer reaches the sub-micron level. By pursuing thinning and multi-layering, even the smallest chip size can simultaneously achieve large capacity and high reliability close to tantalum capacitors.